Power & Cooling Components for AI Data Centers
Source liquid cooling, rack power and high-density infrastructure components for AI, HPC and next-generation data center deployments.
Liquid Cooling Components
Components for direct-to-chip and high-density liquid cooling infrastructure.
Power Distribution Components
Rack-level and high-density electrical distribution components for AI infrastructure.
Have a BOM or Technical Specification?
Engineering and procurement teams can submit their bill of materials, technical drawings, or specifications. Our sourcing team will review requirements and identify qualified manufacturing partners.
Upload Specification
Share technical drawings, datasheets or engineering specifications.
Upload Spec →Describe Your Requirement
Describe your component requirements and we will match suppliers.
Start Sourcing →Built for Engineering & Procurement Teams
Technical Requirement Matching
Component specifications are reviewed against manufacturing partner capabilities before supplier matching.
Multi-Supplier Sourcing
Requirements are sourced across multiple qualified manufacturing partners to ensure competitive options.
OEM & Custom Manufacturing
Custom dimensions, configurations and private-label manufacturing available for qualified projects.
Prototype and Sample Support
Pre-production samples and engineering prototypes coordinated before volume commitment.
Quote Comparison
Multiple supplier quotes consolidated and presented in a structured comparison format.
Factory Coordination
Direct coordination with manufacturing partners on lead times, production scheduling and capacity.
Quality Inspection Support
Pre-shipment inspection and quality documentation coordination for critical components.
International Logistics Support
Freight coordination, customs documentation and delivery to project sites in primary target markets.
Component Categories
Quick Disconnect Couplings
Dry-break and wet-break QDC for direct-to-chip and rack-level liquid cooling loops. Stainless, brass and polymer body options.
Liquid Cooling Manifolds
Custom and standard manifold assemblies for multi-server rack distribution. Stainless steel and aluminium construction.
Cold Plates
Direct-to-chip cold plates for GPU, CPU and ASIC thermal management. Custom footprint and port configurations available.
CDU Components
Coolant distribution unit components including heat exchangers, reservoirs, pumps and control assemblies.
Rack PDU
Basic and metered rack power distribution units. Single-phase and three-phase configurations. IEC and NEMA outlets.
Intelligent Rack PDU
Outlet-level switched and monitored PDU with SNMP, Modbus and DCIM integration. Per-outlet metering and remote switching.
Busway Systems
High-current overhead busway for data center power distribution. Plug-in tap-off units and custom configurations.
High-Current Connectors
Industrial-grade high-current connectors and cable assemblies for rack and busway power distribution.
The Sourcing Process
Submit Requirement
Upload BOM, specification or describe your component requirement.
Technical Review
Our team reviews specifications and clarifies technical requirements.
Supplier Matching
Requirements matched to qualified manufacturing partners.
Quote & Spec Comparison
Multiple supplier quotes and specifications consolidated for review.
Sample / Validation
Pre-production samples coordinated for engineering validation.
Production
Production order placed with factory coordination and scheduling.
QC & Delivery
Quality inspection, documentation and international logistics to site.
Submit Requirement
Upload BOM, specification or describe your component requirement.
Technical Review
Our team reviews specifications and clarifies technical requirements.
Supplier Matching
Requirements matched to qualified manufacturing partners.
Quote & Spec Comparison
Multiple supplier quotes and specifications consolidated for review.
Sample / Validation
Pre-production samples coordinated for engineering validation.
Production
Production order placed with factory coordination and scheduling.
QC & Delivery
Quality inspection, documentation and international logistics to site.
Need a Custom Component?
Engineering teams with non-standard requirements can submit custom component specifications. We coordinate drawing-based manufacturing with qualified OEM partners for prototype through production volumes.
Submit Custom RequirementCustom Capabilities
Beyond Individual Components
Engineering and procurement teams with larger AI data center infrastructure requirements can submit a project RFQ for multi-component sourcing. We coordinate across product categories to support complete infrastructure builds.
Start a Sourcing ProjectTechnical Resources
Reference material for engineers and procurement teams specifying AI data center infrastructure.
AI Data Center Liquid Cooling
Overview of liquid cooling architectures for high-density AI compute, including direct-to-chip, immersion and rear-door heat exchanger approaches.
Read MoreDirect-to-Chip Cooling
Technical guide to direct liquid cooling for GPU and CPU cold plate selection, flow rates, pressure drop and manifold design considerations.
Read MoreQDC Selection Guide
How to specify quick disconnect couplings for data center liquid cooling: body material, pressure rating, flow coefficient and compatibility considerations.
Read MoreReady to Source Components?
Submit your requirement and our technical sourcing team will respond within one business day.