Engineering guides for AI data center liquid cooling, rack power distribution and infrastructure component selection.
Covers the complete direct-to-chip cooling loop architecture: CDU, manifold, hose assemblies, QDC couplings, cold plates, coolant flow, monitoring, and leak detection. Includes a component architecture diagram and procurement considerations.
Engineering selection guide for quick disconnect couplings. Covers connection size, flow requirement, pressure drop, coolant compatibility, seal materials, dry-break vs wet-break, mating cycles, and integration with hose, manifold, and cold plate.
Selection guide for cold plates in AI server and GPU direct-to-chip cooling. Covers processor type, thermal load, flow requirement, pressure drop, geometry, materials, channel architecture, and QDC integration.
Explains why AI rack power density is increasing and the infrastructure implications. Covers rack PDU, busway, busbar, high-current connectors, cable assemblies, and power monitoring for high-density AI deployments.
Selection guide for rack PDUs in high-density AI data center deployments. Covers input configuration, outlet requirements, metering levels, redundancy, busway integration, and a complete selection checklist.
Objective comparison of overhead busway and cable assemblies for data center power distribution. Covers architecture, installation, scalability, rack changes, space considerations, maintenance, and high-density AI rack deployment factors.
Submit your BOM or specification for a sourcing review. We work with qualified manufacturers to source liquid cooling and power distribution components for AI data center projects.
